IC Sockets

Results: 18.692
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of 18.692
Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Type
Number of Positions or Pins (Grid)
Pitch - Mating
Contact Finish - Mating
Contact Finish Thickness - Mating
Contact Material - Mating
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - Post
Contact Finish Thickness - Post
Contact Material - Post
Housing Material
Operating Temperature
1-2199298-4
1-2199298-4
CONN IC DIP SOCKET 16POS TIN
TE Connectivity AMP Connectors
0
In Stock
Check Lead Time
1 : 0,24000 €
Tube
Tube
Active
DIP, 0.3" (7.62mm) Row Spacing
16 (2 x 8)
0.100" (2.54mm)
Tin
60.0µin (1.52µm)
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass, Copper
Polybutylene Terephthalate (PBT), Glass Filled
-40°C ~ 105°C
0
In Stock
Check Lead Time
1 : 0,20000 €
Tube
Tube
Active
DIP, 0.3" (7.62mm) Row Spacing
6 (2 x 3)
0.100" (2.54mm)
Tin
60.0µin (1.52µm)
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass, Copper
Polybutylene Terephthalate (PBT), Glass Filled
-40°C ~ 105°C
1-2199298-9
1-2199298-9
CONN IC DIP SOCKET 28POS TIN
TE Connectivity AMP Connectors
0
In Stock
Check Lead Time
1 : 0,77000 €
Tube
Tube
Active
DIP, 0.3" (7.62mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Tin
60.0µin (1.52µm)
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass, Copper
Polybutylene Terephthalate (PBT), Glass Filled
-40°C ~ 105°C
0
In Stock
Check Lead Time
1 : 1,22000 €
Tube
-
Tube
Active
DIP, 0.3" (7.62mm) Row Spacing
18
0.100" (2.54mm)
Tin
196.9µin (5.00µm)
Copper Alloy
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
78.7µin (2.00µm)
Copper Alloy
Thermoplastic
-55°C ~ 125°C
0
In Stock
Check Lead Time
1 : 1,35000 €
Tube
-
Tube
Active
DIP, 0.3" (7.62mm) Row Spacing
20
0.100" (2.54mm)
Tin
196.9µin (5.00µm)
Copper Alloy
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
78.7µin (2.00µm)
Copper Alloy
Thermoplastic
-55°C ~ 125°C
265
In Stock
1 : 5,08000 €
Tube
Tube
Active
DIP, 0.6" (15.24mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
1-2324271-7
1-2324271-2
LEFT SEGMEN LGA4189-4 SOCKET-P4
TE Connectivity AMP Connectors
0
In Stock
1 : 25,42000 €
Tray
-
Tray
Last Time Buy
LGA 4189
2092
0.039" (1.00mm)
Gold
30.0µin (0.76µm)
Copper Alloy
Surface Mount
Open Frame
Solder
0.034" (0.86mm)
Gold
30.0µin (0.76µm)
Copper Alloy
Thermoplastic
-25°C ~ 100°C
84-537-21
84-537-21
CONN SOCKET PLCC ZIF 84POS GOLD
Aries Electronics
159
In Stock
1 : 320,66000 €
Bulk
Bulk
Active
PLCC, ZIF (ZIP)
84 (4 x 21)
0.100" (2.54mm)
Gold
12.0µin (0.30µm)
-
Surface Mount
Closed Frame
-
-
-
-
-
-
-
ICA-316-STT
ICA-316-STT
CONN IC DIP SOCKET 16POS TIN
Samtec Inc.
0
In Stock
Check Lead Time
1 : 1,54000 €
Tube
Tube
Active
DIP, 0.3" (7.62mm) Row Spacing
16 (2 x 8)
0.100" (2.54mm)
Tin
-
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polyester, Glass Filled
-55°C ~ 105°C
ICF-308-x-O
ICF-308-T-I-TR
.100" SURFACE MOUNT SCREW MACHIN
Samtec Inc.
0
In Stock
Check Lead Time
1 : 1,60000 €
Cut Tape (CT)
475 : 0,90488 €
Tape & Reel (TR)
Tape & Reel (TR)
Cut Tape (CT)
Digi-Reel®
Active
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
0.100" (2.54mm)
Tin
-
Beryllium Copper
Surface Mount
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Beryllium Copper
Liquid Crystal Polymer (LCP)
-55°C ~ 125°C
ICA-320-STT
ICA-320-STT
CONN IC DIP SKT 20POS
Samtec Inc.
0
In Stock
Check Lead Time
1 : 1,89000 €
Tube
Tube
Active
DIP, 0.3" (7.62mm) Row Spacing
20 (2 x 10)
0.100" (2.54mm)
Tin
-
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polyester, Glass Filled
-55°C ~ 105°C
ICA-324-SST
ICA-324-SST
.100" SCREW MACHINE DIP SOCKET
Samtec Inc.
717
In Stock
1 : 2,52000 €
Tube
Tube
Active
DIP, 0.3" (7.62mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polyester, Glass Filled
-55°C ~ 125°C
ICA-628-STT
ICA-628-STT
CONN IC DIP SOCKET 28POS TIN
Samtec Inc.
0
In Stock
Check Lead Time
1 : 2,57000 €
Tube
Tube
Active
DIP, 0.6" (15.24mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Tin
-
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polyester, Glass Filled
-55°C ~ 105°C
ICA-314-SGT
ICA-314-SGT
CONN IC DIP SOCKET 14POS GOLD
Samtec Inc.
0
In Stock
Check Lead Time
1 : 2,60000 €
Tube
Tube
Active
DIP, 0.3" (7.62mm) Row Spacing
14 (2 x 7)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
10.0µin (0.25µm)
Brass
Polyester, Glass Filled
-55°C ~ 125°C
ICO-320-MTT
ICO-320-MTT
.100" LOW PROFILE SCREW MACHINE
Samtec Inc.
0
In Stock
Check Lead Time
1 : 2,61000 €
Tube
Tube
Active
DIP, 0.3" (7.62mm) Row Spacing
20 (2 x 10)
0.100" (2.54mm)
Tin
-
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polyester, Glass Filled
-55°C ~ 105°C
ICA-316-SGT
ICA-316-SGT
CONN IC DIP SKT 16POS
Samtec Inc.
0
In Stock
Check Lead Time
1 : 2,81000 €
Tube
Tube
Active
DIP, 0.3" (7.62mm) Row Spacing
16 (2 x 8)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
10.0µin (0.25µm)
Brass
Polyester, Glass Filled
-55°C ~ 125°C
302
In Stock
1 : 3,84000 €
Tube
Tube
Active
DIP, 0.3" (7.62mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin-Lead
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
ICA-324-SGT
ICA-324-SGT
.100" SCREW MACHINE DIP SOCKET
Samtec Inc.
0
In Stock
Check Lead Time
1 : 4,08000 €
Tube
Tube
Active
DIP, 0.3" (7.62mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
10.0µin (0.25µm)
Brass
Polyester, Glass Filled
-55°C ~ 125°C
ICA-316-ZAGT
ICA-316-ZAGT
CONN IC DIP SOCKET 16POS GOLD
Samtec Inc.
0
In Stock
Check Lead Time
1 : 4,48000 €
Tube
Tube
Active
DIP, 0.3" (7.62mm) Row Spacing
16 (2 x 8)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
10.0µin (0.25µm)
Brass
Polyester, Glass Filled
-55°C ~ 125°C
560
In Stock
1 : 18,40000 €
Tube
Tube
Active
DIP, 0.6" (15.24mm) Row Spacing
40 (2 x 20)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
1-2324271-7
1-2324271-1
RIGHT SEGMEN LGA4189-4 SOCKET-P4
TE Connectivity AMP Connectors
0
In Stock
1 : 24,21000 €
Tray
-
Tray
Last Time Buy
LGA 4189
2092
0.039" (1.00mm)
Gold
30.0µin (0.76µm)
Copper Alloy
Surface Mount
Open Frame
Solder
0.034" (0.86mm)
Gold
30.0µin (0.76µm)
Copper Alloy
Thermoplastic
-25°C ~ 100°C
ICF-308-x-O
ICF-308-T-O
CONN IC DIP SOCKET 8POS TIN
Samtec Inc.
0
In Stock
2.016
Factory
Check Lead Time
1 : 1,29000 €
Tube
Tube
Active
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
0.100" (2.54mm)
Tin
-
Beryllium Copper
Surface Mount
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Beryllium Copper
Liquid Crystal Polymer (LCP)
-55°C ~ 125°C
ICF-308-x-O
ICF-308-S-O
CONN IC DIP SOCKET 8POS TIN
Samtec Inc.
0
In Stock
Check Lead Time
1 : 2,63000 €
Tube
Tube
Active
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Surface Mount
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Beryllium Copper
Liquid Crystal Polymer (LCP)
-55°C ~ 125°C
ICA-314-SGG
ICA-314-SGG
CONN IC DIP SOCKET 14POS GOLD
Samtec Inc.
0
In Stock
3.936
Factory
Check Lead Time
1 : 3,54000 €
Tube
Tube
Active
DIP, 0.3" (7.62mm) Row Spacing
14 (2 x 7)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Brass
Polyester, Glass Filled
-55°C ~ 125°C
400
In Stock
400 : 3,62978 €
Tape & Reel (TR)
Tape & Reel (TR)
Active
PLCC
32 (2 x 7, 2 x 9)
0.050" (1.27mm)
Tin
100.0µin (2.54µm)
-
Surface Mount
Closed Frame
Solder
0.050" (1.27mm)
Tin
200.0µin (5.08µm)
-
Polyphenylene Sulfide (PPS)
-
Showing
of 18.692

IC Sockets

Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.